| Mfg Part Number: TN2009 | Manufacturer: Xerox Corporation | NSN : 5961-01-089-8863 |
| Item Name : transistor | CAGE Code : 18338 | FSC : 5961 Semiconductor Devices and Associated Hardware |
The NSN 5961-01-089-8863 products that we feature by MFG Xerox Corporation are paired alongside CAGE Code 18338 for TN2009 NSN Part Number. Emergent Purchasing utilizes CAGE Codes, allowing our customers to narrow down our vast listing by using our optimized search engine. If you are familiar with the CAGE Codes associated with the particular NSN products you wish to purchase, we invite you to use them. If you have more information regarding the NSN components you wish to purchase, please provide such details in an RFQ form. When you fill out a form for TN2009, in return, you will be provided a competitive quote for your comparisons in just 15 minutes or less.
Thank you for choosing to rely on Emergent Purchasing for all your operational needs. You have reached our NSN RFQ page featuring highly sought-after NSN 5961-01-089-8863 parts and components with Transistor manufactured by MFG Xerox Corporation. Some of these items include part number TN2009 under FSC5961 Semiconductor Devices and Associated Hardware, and various others, all of which have been subjected to a myriad of quality assurance measures, tests, verifications, and assessments. At Emergent Purchasing, we make it our priority to only source from top global manufacturers that we trust, that way you never have to worry about the reliability or authenticity of our items.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-089-8863 Item Description: Transistor | 5961 | 010898863 | 0 | N | ||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | G | |||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Tn2009 | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | METAL |
| ABHP | OVERALL LENGTH | 0.340 INCHES MAXIMUM |
| ADAV | OVERALL DIAMETER | 0.620 INCHES MAXIMUM |
| AKPV | MOUNTING FACILITY QUANTITY | 2 |
| ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-66 |
| AXGY | MOUNTING METHOD | UNTHREADED HOLE |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | III SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 90.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-BASE, EMITTER OPEN |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 4.00 AMPERES SOURCE CUTOFF CURRENT MAXIMUM AND 2.00 AMPERES SOURCE CUTOFF CURRENT MINIMUM |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS JUNCTION |
| FEAT | SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: NPN |
| PMLC | PRECIOUS MATERIAL AND LOCATION | LEADS COATING GOLD |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD AND 1 CASE |
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