| Mfg Part Number: S82S123F-883C | Alternate P/N: S82S123F883C | Manufacturer: Philips Semiconductors Ltd |
| NSN : 5962-01-236-6688 | Item Name : microcircuit memory | CAGE Code : 18324 |
| FSC : 5962 Microcircuits Electronic |
The NSN 5962-01-236-6688 products that we feature by MFG Philips Semiconductors Ltd are paired alongside CAGE Code 18324 for S82S123F-883C NSN Part Number. Emergent Purchasing utilizes CAGE Codes, allowing our customers to narrow down our vast listing by using our optimized search engine. If you are familiar with the CAGE Codes associated with the particular NSN products you wish to purchase, we invite you to use them. If you have more information regarding the NSN components you wish to purchase, please provide such details in an RFQ form. When you fill out a form for S82S123F-883C, in return, you will be provided a competitive quote for your comparisons in just 15 minutes or less.
Thank you for choosing to rely on Emergent Purchasing for all your operational needs. You have reached our NSN RFQ page featuring highly sought-after NSN 5962-01-236-6688 parts and components with Microcircuit Memory manufactured by MFG Philips Semiconductors Ltd. Some of these items include part number S82S123F-883C under FSC5962 Microcircuits Electronic, and various others, all of which have been subjected to a myriad of quality assurance measures, tests, verifications, and assessments. At Emergent Purchasing, we make it our priority to only source from top global manufacturers that we trust, that way you never have to worry about the reliability or authenticity of our items.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-236-6688 Item Description: MICROCIRCUIT MEMORY | 5962 | 012366688 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| S82S123F/883C | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.785 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.302 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.175 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 332.8 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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