| Mfg Part Number: PAL16R4AML-883B | Alternate P/N: PAL16R4AML883B | Manufacturer: Mmi Inc |
| NSN : 5962-01-264-3009 | Item Name : microcircuit memory | CAGE Code : 50364 |
| FSC : 5962 Microcircuits Electronic |
The NSN 5962-01-264-3009 products that we feature by MFG Mmi Inc are paired alongside CAGE Code 50364 for PAL16R4AML-883B NSN Part Number. Emergent Purchasing utilizes CAGE Codes, allowing our customers to narrow down our vast listing by using our optimized search engine. If you are familiar with the CAGE Codes associated with the particular NSN products you wish to purchase, we invite you to use them. If you have more information regarding the NSN components you wish to purchase, please provide such details in an RFQ form. When you fill out a form for PAL16R4AML-883B, in return, you will be provided a competitive quote for your comparisons in just 15 minutes or less.
Thank you for choosing to rely on Emergent Purchasing for all your operational needs. You have reached our NSN RFQ page featuring highly sought-after NSN 5962-01-264-3009 parts and components with Microcircuit Memory manufactured by MFG Mmi Inc. Some of these items include part number PAL16R4AML-883B under FSC5962 Microcircuits Electronic, and various others, all of which have been subjected to a myriad of quality assurance measures, tests, verifications, and assessments. At Emergent Purchasing, we make it our priority to only source from top global manufacturers that we trust, that way you never have to worry about the reliability or authenticity of our items.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-264-3009 Item Description: MICROCIRCUIT MEMORY | 5962 | 012643009 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| PAL16R4AML/883B | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.358 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.358 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES FORWARD CURRENT, MAXIMUM PEAK TOTAL VALUE NOT APPLICABLE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
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