| Mfg Part Number: GC41374-00 | Alternate P/N: GC4137400 | Manufacturer: Microsemi Corp |
| NSN : 5961-01-367-1968 | Item Name : semiconductor devic | CAGE Code : 50101 |
| FSC : 5961 Semiconductor Devices and Associated Hardware |
The NSN 5961-01-367-1968 products that we feature by MFG Microsemi Corp are paired alongside CAGE Code 50101 for GC41374-00 NSN Part Number. Emergent Purchasing utilizes CAGE Codes, allowing our customers to narrow down our vast listing by using our optimized search engine. If you are familiar with the CAGE Codes associated with the particular NSN products you wish to purchase, we invite you to use them. If you have more information regarding the NSN components you wish to purchase, please provide such details in an RFQ form. When you fill out a form for GC41374-00, in return, you will be provided a competitive quote for your comparisons in just 15 minutes or less.
Thank you for choosing to rely on Emergent Purchasing for all your operational needs. You have reached our NSN RFQ page featuring highly sought-after NSN 5961-01-367-1968 parts and components with Semiconductor Devic manufactured by MFG Microsemi Corp. Some of these items include part number GC41374-00 under FSC5961 Semiconductor Devices and Associated Hardware, and various others, all of which have been subjected to a myriad of quality assurance measures, tests, verifications, and assessments. At Emergent Purchasing, we make it our priority to only source from top global manufacturers that we trust, that way you never have to worry about the reliability or authenticity of our items.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-367-1968 Item Description: Semiconductor Devic | 5961 | 013671968 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | G | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Gc41374-00 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | METAL |
| ABHP | OVERALL LENGTH | 0.010 INCHES MINIMUM AND 0.020 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.005 INCHES MINIMUM AND 0.010 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.010 INCHES MINIMUM AND 0.020 INCHES MAXIMUM |
| AKPV | MOUNTING FACILITY QUANTITY | 1 |
| AXGY | MOUNTING METHOD | THREADED HOLE |
| CBBL | FEATURES PROVIDED | BURN IN AND GOLD PLATED LEADS |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 80.0 MINIMUM BREAKDOWN VOLTAGE, INSTANTANEOUS |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 10.00 MICROAMPERES COLLECTOR CURRENT, DC PEAK |
| FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS PROCESS; JUNCTION PATTERN ARRANGEMENT: PN |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINALS GOLD |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TTQY | TERMINAL TYPE AND QUANTITY | 1 UNTHREADED HOLE AND 1 BONDING PAD |
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