Mfg Part Number: DPS 1X16-RB | Alternate P/N: DPS1X16RB | Manufacturer: Dpac Technologies Corp |
NSN : 5962-01-356-6553 | Item Name : microcircuit assemb | CAGE Code : 66847 |
FSC : 5962 Microcircuits Electronic |
The NSN 5962-01-356-6553 products that we feature by MFG Dpac Technologies Corp are paired alongside CAGE Code 66847 for DPS 1X16-RB NSN Part Number. Emergent Purchasing utilizes CAGE Codes, allowing our customers to narrow down our vast listing by using our optimized search engine. If you are familiar with the CAGE Codes associated with the particular NSN products you wish to purchase, we invite you to use them. If you have more information regarding the NSN components you wish to purchase, please provide such details in an RFQ form. When you fill out a form for DPS 1X16-RB, in return, you will be provided a competitive quote for your comparisons in just 15 minutes or less.
Thank you for choosing to rely on Emergent Purchasing for all your operational needs. You have reached our NSN RFQ page featuring highly sought-after NSN 5962-01-356-6553 parts and components with Microcircuit Assemb manufactured by MFG Dpac Technologies Corp. Some of these items include part number DPS 1X16-RB under FSC5962 Microcircuits Electronic, and various others, all of which have been subjected to a myriad of quality assurance measures, tests, verifications, and assessments. At Emergent Purchasing, we make it our priority to only source from top global manufacturers that we trust, that way you never have to worry about the reliability or authenticity of our items.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-356-6553 Item Description: Microcircuit Assemb | 5962 | 013566553 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Dps 1x16-Rb | 5 | 2 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.999 INCHES NOMINAL |
ADAT | BODY WIDTH | 0.999 INCHES NOMINAL |
ADAU | BODY HEIGHT | 0.170 INCHES NOMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND RADIATION HARDENED AND STATIC OPERATION |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 4 MEMORY |
FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS CRITICAL ITEMS |
NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 31 PIN |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CZER | MEMORY DEVICE TYPE | RAM |
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